Posts

Jinming Zhuang and Prof. Peipei Zhou participated in DAC'60 at San Francisco from 07/09/2023-07/14/2023. Jinming has presented research paper “High Performance, Low Power Matrix Multiply Design on ACAP: from Architecture, Design Challenges and DSE Perspectives” and 1 university demo on real-time vision transformer inference on AMD Versal ACAP.

Our ICCAD 2023 submission, “AIM: Accelerating Arbitrary-precision Integer Multiplication on Heterogeneous Reconfigurable Computing Platform Versal ACAP ” is accepted in ICCAD 2023! Congratulations to my Ph.D. students Zhuoping Yang and Jinming, especially Zhuoping, on his remarkable achievement in getting his first 1st-author paper in the first year of Ph.

What? 🎉 The 3rd International HiPChips Workshop, along with ISCA-2023 Online Attend? 🌐 Virtual (Yes, It is Free to Everyone) !! Zoom Link: https://us06web.zoom.us/j/83130309538 When? ⏰ Day-Date: Saturday, June 17th,2023, 9 AM-5 PM, Whole-Day Event

On 04/07/2023, Prof. Zhou was invited to CMU CrossRoads Seminar to present “CHARM: Composing Heterogeneous Accelerators for Matrix Multiply on Versal ACAP Architecture”. Check it out on the recorded video: YouTube

Our DAC 2023 submission, “AutoMM: Energy-Efficient Multi-Data-Type Matrix Multiply Design on Heterogeneous Programmable System-on-Chip” is accepted in DAC 2023! Congratulations to my PhD students Jinming Zhuang and Zhuoping Yang!

Our FPGA 2023 submission, CHARM: Composing Heterogeneous Accelerators for Matrix Multiply on Versal ACAP Architecture is accepted in FPGA 2023! Congratulations to my PhD student Jinming Zhuang on the first-author publication!

Prof. Zhou will attend DAC 2022 taking place this July 10-14 at the Moscone Center West in San Francisco, CA. Prof. Zhou will serve as the Session Chair for EDA System-on-Chip Design Methodology “Fantastic SoCs and Where to Find Them!

Prof. Zhou will serve as TPC for 2022 International Conference on Computer-Aided Design, 2023 Design, Automation and Test in Europe Conference | The European Event for Electronic System Design & Test , 2023 IEEE/ACM Conference on Connected Health Applications, Systems, and Engineering Technologies (CHASE)

Welcome Zhuoping! Zhuoping will join the lab in August 2022. Zhuoping graduated with Bachelor of Engineering in Electronic Packaging and Master of Engineering in Electronic Packaging from Huazhong University of Science and Technology.

One paper “EF-Train: Enable Efficient On-device CNN Training on FPGA Through Data Reshaping for Online Adaptation or Personalization” got accepted in ACM Transactions on Design Automation of Embedded Systems (TODAES) Special Issue on Energy-Efficient AI Chips